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Overview
Documentation
Documentation
Description
LOW PROFILE, HIGH CURRENT DENSITY CABLE ASSEMBLY
Pwr Profile+® I/O address applications requiring additional power density in space constrained, chassis-based equipment platforms. The innovative power contact design has a lower profile for cable-to-board applications.
- Two power contacts for power and return applications
- Two signal pins for presence detection or power control
- Optional grounding shield on the board connector
- Touch-proof housing design
- Polarization to ensure proper mating
Features & Benefits
Features
- Current rating up to 34A per contact for two power contacts without exceeding a 30°C temperature rise in still air
- 14AWG to 10AWG
- 10.5mm profile height
- Vented cable housing design
- Touch-proof feature design compliant with IEC60950 standard
- Polarized housing design
- Two signal contacts
Benefits
- high current density in compact design
- Offers design flexibility
- Low profile allows more airflow for system cooling in limited space applications
- Maximizes heat dissipation
- Safety feature
- Ensures proper mating
- Supports presence detection or power control