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Overview
Documentation
Documentation
Description
LOW PROFILE, HIGH CURRENT DENSITY CABLE ASSEMBLY
Pwr Profile® I/O address applications requiring additional power density in space constrained, chassis-based equipment platforms. The innovative power contact design has a lower profile for cable-to-board applications.
Low profile 9.2mm height
Two power contacts for power and return applications
Touch-proof housing design
Polarization to ensure proper mating
Features & Benefits
Features
- Current rating up to 20A per contact for two power contacts without exceeding a 30°C temperature rise in still air
- 16AWG to 12AWG
- 9.2mm profile height
- Vented cable housing design
- Touch-proof feature design compliant with IEC60950 standard
- Polarized housing design
Benefits
- high current density in compact design
- Offers design flexibility
- Low profile allows more airflow for system cooling in limited space applications
- Maximizes heat dissipation
- Safety feature
- Ensures proper mating