QSFP DD OverPass™ Assemblies

Overview

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Overview

Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Direct chip to IO port connection; accommodates straight and cross over wiring; custom IO mapping; heat sinks and light pipes
  • Significant reduction in signal loss transmission; addresses system thermal and mechanical needs
  • Direct wire attachment to connector contact & robust shield termination coupled with high performance differential pair cabling
  • Delivers superior signal integrity performance
  • Full QSFP DD industry standard compatibility
  • Assures proper mating of cables, AOC's and optical modules
  • Full support of 56G & 112G signaling speeds and anticipated 224G
  • Full signal integrity performance compatibility
  • Integrated system solution including assembly aids
  • Ease of assembly into hardware systems
  • 100% full performance testing and characterization
  • Assures full product functionality
  • Full vertical integration of product components
  • Connectors and cable supplied, processed, terminated & tested by Amphenol
  • Multiple near chip / on package IO connector options
  • Choice of multiple IO solutions to address signal integrity performance and mechanical requirements

Target Markets & Applications