QSFP OverPass™ Assemblies

Overview

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Overview

Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • Direct chip to IO port connection; accommodates straight and cross over wiring; custom IO mapping; heat sinks and light pipes
  • Significant reduction in signal loss transmission; addresses system thermal and mechanical needs
  • Direct wire attachment to connector contact & robust shield termination coupled with high performance differential pair cabling
  • Delivers superior signal integrity performance
  • Full QSFP industry standard compatibility
  • Assures proper mating of cables, AOC's and optical modules
  • Full support of 28G & 56G signaling speeds
  • Full signal integrity performance compatibility
  • Integrated system solution including assembly aids
  • Ease of assembly into hardware systems
  • 100% full performance testing and characterization
  • Assures full product functionality
  • Full vertical integration of product components
  • Connectors and cable supplied, processed, terminated & tested by Amphenol
  • Multiple near chip / on package IO connector options
  • Choice of multiple IO solutions to address signal integrity performance and mechanical requirements
  • Flexible sideband signal termination options
  • Cabled to either Minitek® cable connector, to the near chip IO connector or press fit terminated at QSFP connector

Target Markets & Applications