UltraPass™ OverPass™ Assemblies

Overview
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Overview
Documentation
Documentation
Description

224G CONNECTION DIRECTLY FROM CHIP SITE TO EXTERNAL PORTS

UltraPass™ enables arrayed connector layouts for near-chip and on-package IO solutions, providing the highest differential pair count interconnect offering in the market.

  • Full support of up to 224G signaling speeds
  • Reduced overall system cost
  • Lower loss interconnect from chip site to external port
  • Lower loss interconnect from chip site to chip site
  • Short signal travel length from cable to board pad
  • Delivers superior signal integrity performance
Features & Benefits
FEATURES BENEFITS
  • Direct point-to-point connection; high-density two-piece IO connector and cable system
  • Up to 10X Reduction in signal loss; addresses system thermal and mechanical needs
  • Full support of up to 224G signaling speeds
  • Highest signal speed in the market today
  • Ease of application and termination; pick-in-place board connector and guided cable mating
  • Ease of assembly into hardware systems
  • Full performance testing and characterization on 100% of product
  • Full signal integrity performance compatibility
  • Full vertical integration of product components: Connectors and cable supplied, processed, terminated and tested by Amphenol
  • Provides full confidence in the whole system reliability
  • 16, 40, and 64 differential pair configurations
  • Choice of multiple IO solutions to address differential pair count and performance
  • Pairs with OSFP, QSFP DD and QSFP OverPass™ interfaces to provide high speed external IO port products with a direct link to processor chips
  • Highest density internal cable solution on the market
  • Eliminates the need for re-timers and expensive low-loss PCB laminates
  • Lowers system costs in initial design and any future upgrades
  • RoHS 2 compliant
  • Environmentally friendly
Target Markets & Applications