UltraPort™ QSFP+

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Overview

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Description

QSFP28 with Stamped and Formed Contact Design

Amphenol's UltraPort™ QSFP+ interconnect system comprises of a 38-position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost optimized solutions. The UltraPort™ QSFP+ connector supports next generation 100G+ applications and transmits up to 28 Gb/s per channel. It features a stamped and formed contact design providing improved mechanical durability. The resonance dampening features of the design allows superior signal integrity. The design minimizes crosstalk and transmission line impedance discontinuity across the connector interface.

Electrical interface employs 4 lanes that operates up to 28 Gb/s per channel
Passive copper and optical solutions
Stamped and formed contact design provides improved mechanical durability
The resonance dampening features minimize crosstalk and transmission line impedance discontinuity across the connector interface

Features & Benefits

FEATURES	BENEFITS
Electrical interface employs 4 lanes that operate up to 28 Gb/s per channel	100Gb/s aggregated bandwidth solution
Passive copper and optical solutions	Support various application requirements
Stamped and formed contact design	Improved mechanical durability
Resonance dampening features	Minimizes crosstalk and transmission line impedance discontinuity and provides enhanced signal integrity

Part Numbers

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