USB 3.1 GEN 1

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FEATURES	BENEFITS
Available in different height options	Customer design flexibility
Optional terminal DIP length	Suitable for different PCB thickness
High reliable terminal design	Superior electrical performance for low contact resistance
SuperSpeed up to 5Gb/s transmission	High performance in Signal Integrity (SI)
Optimized shell structure design	Full metal shielding for Electromagnetic Interference (EMI) / Radio-Frequency interference (RFI) / Electromagnetic Discharge (ESD) protection
Rugged gold-plated leaf contact for reliability needs	Improves contact resistance and prevents corrosion
Halogen-free material	Meets environmental, health and safety requirements

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