Micro USB 3.1 GEN 1

Overview

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Overview

Documentation
Documentation
Description
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Features & Benefits
FEATURES BENEFITS
  • USB 3.1 Gen 1 specification compliance with 10 positions
  • Plug operation includes a snap in catch with tactile feedback ensuring an easy connection
  • Optional DIP and SMT for shell application
  • Shell reliable mounted on PCB
  • Robust two layer shells design
  • Peeling force improvement
  • Super speed up to 5Gb/s transmission
  • High performance in Signal Integrity (SI)
  • Optimized shell structure design
  • Full metal shielding for Electromagnetic Interference (EMI) / Radio-Frequency interference (RFI) / Electromagnetic Discharge (ESD) protection
  • Rugged gold-plated leaf contact for reliability needs
  • Improves contact resistance and prevents corrosion
  • Halogen-free material
  • Meets environmental, health and safety requirements
  • 4 solder pad solderable at shell bottom ensuring mounting force
  • Improved real estate space savings

Target Markets & Applications