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Overview
Documentation
Documentation
Description
Features & Benefits
Features
- Available in 5, 6 and 8 Row
- 2 x 2.25 mm grid
- 25-38 real signals per linear inch
- VHDM-HSD™ backplane module available in 10 position and 25 position
- Modular design allows for VHDM-HSD™ (differential) to be combined with VHDM® (single-ended) on the same stainless steel rear organizer (stiffener)
- Shared components (guides, powers, etc.) with VHDM®
- Embedded capacitor capability (5 Row eHSD®)
Benefits
- Backward mate compatible derivatives allowing for cost effective upgrade paths
- Data rates up to 25 Gb/s (eHSD® 5+)
- Embedded capacitor capability (eHSD®5+)
- Large array of wafer types that can be combined on one stiffener allows for design flexibility
- Vertically integrated supply chain using automated assembly equipment and full cavitation on component tooling allows for an optimized cost solution