XCede^® HD Plus

Click Image to Enlarge

FEATURES	BENEFITS
Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns	Backwards mating compatible with XCede^®HD connector
Compliance with the Hard Metric form factor requirements outlined in EN 61076-4-101:2001	Highest density with 1.8mm pitch
42 to 84 differential pairs per inch (16 to 33 differential pairs per centimeter)	Meets the high density needs of today's challenging architectures
Embedded capacitor available	For additional performance margin and overall system cost savings
Leverages on application specific derivatives, including coplanar and orthogonal configurations	Provides a complete solution for customer's unique requirements
Meets standards, such as the IEEE 802.3bj	Provides designers with the flexibility to design systems with an easy upgrade path to 56 Gb/s PAM4 performance
Added metal shield tied to ground system with conductive posts	Reduces crosstalk
Modified mating beams vs. previous XCede^®HD versions to move resonance past 25GHz	Moves resonance past 25GHz
Miniaturized compliant pins	Improves impedance matching and enables deeper backdrilling
XCede^®HD Plus backplane sidewall strength is 2X the strength of other popular backplane connectors	Stands out among competition in terms of durability
Three levels of contact sequencing	Enables hot plugging

XCede® HD Plus