XCede^® HD

Click Image to Enlarge

FEATURES	BENEFITS
Data rates scalable from 6 Gb/s to 20 Gb/s to support system upgrades without costly redesigns Compliance with the Hard Metric form factor requirements outlined in EN 61076-4-101:2001 Compliance with the Hard Metric form factor requirements outlined in EN 61076-4-101:2001	Meets standards, such as the IEEE 802.3ap, having practical performance requirements geared for future data rates and makes a significant impact on current systems Highest density with 1.8mm pitch
Proprietary crosstalk reducing technologies	Excellent common mode performance with proven EMI and signal integrity advantages
Miniaturized compliant pins	Improves impedance matching and enables deeper backdrilling
Leverages on application specific derivatives, including coplanar and orthogonal configurations	Provides a complete solution for customer's unique requirements
Shield contacts mate before signal contacts providing up to 4mm minimum wipe	Enables hot plugging
XCede^®HD backplane sidewall strength is 2X the strength of other popular backplane connectors	Stands out among competition in terms of durability
Embedded capacitor available	For additional margin and overall system cost savings
28 to 84 differential pairs per inch (11 to 33 differential pairs per centimeter)	Meets the high density needs of today's challenging architectures
Meets standards, such as the IEEE 802.3bj	Exceeds the 10GBASE-KR ICR guidelines and ensures compliance with future 28 Gb/s specifications

XCede® HD