XCede^® I/O

The XCede^® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede^® I/O connector supports next generation 100G+ applications and transmits up to 25 Gbps/serial-lane. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes crosstalk and transmission line impedance discontinuity across the connector interface.