XCede^® I/O

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Documentation

Datasheet
TB-2149 Routing Guidelines

Overview Part Numbers Configure Your Product Choose Your Configuration Target Markets & Applications

Overview

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Overview

Documentation

Datasheet
TB-2149 Routing Guidelines

Description

The XCede^® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede^® I/O connector supports next generation 100G+ applications and transmits up to 25 Gbps/serial-lane. It features a stamped and formed contact design providing improved mechanical durability and resonance dampening features for superior performance. The design minimizes crosstalk and transmission line impedance discontinuity across the connector interface.

Features & Benefits

FEATURES
Our XCede^® I/O connector enables new levels of speed, and our engineers are developing new solutions every day to further enable this data revolution.
Data Rates Up to 25Gbps/channel
Various Cage & Connector Options 32 position, variable pitch connector with each port offering 4 channels Pin-in-paste technology
Next Generation Can support 100Gbps+ applications Improved NEXT & FEXT performance
Green and Environmental Friendly RoHS compliant Halogen Free

Part Numbers

USA
EU
ASIA

XCede® I/O

XCede® I/O

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Documentation

Documentation

Overview

Overview

Documentation

Documentation

Description

Features & Benefits

Part Numbers

Target Markets & Applications

XCede^® I/O

XCede^® I/O