XCede^® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range.

XCede^® connectors also address requirements for high linear signal density at the backplane and daughter card interface. Complementary guide and power modules are also included in the product range. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or monoblock.

The XCede^® backplane header system provides ruggedness and long-term reliability required by today's systems. The wide ground contacts feature a stiffnessenhancing rib and are advanced ahead of the signals for robustness and signal pin protection.